Physics 242: Solid State Technology & Microelectronics

  

 

 

Professor John F. Currie

e-mail: currie@physics.georgetown.edu

 

LECTURE: Tuesday; 2:15 – 4:05 in Reiss 501

LAB: Thursday; 2:15 – 4:05 in Reiss 172

with

Paul Goldey

e-mail: goldey@physics.georgetown.edu

Textbooks:

1. Textbook: Muller & Kamins: Device Electronics for Integrated Circuits, 3rd Ed., Muller /2002 0471593982

2. (Reference) S.M.Sze, Semiconductor Devices: Physics & Technology, '85
3. (Reference) D. Hodges & Jackson, Analysis & Design of Digital ICs, '83
4. (Reference) G.T.A.Kovacs, Micromachined Transducers Sourcebook/1998

5. (Reference) M. Madou, Fundamentals of Microfabrication: 0-08493-9451-1/ 1997

6. (Reference) S.Kasap, Principles of Electrical Engineering, Materials and Devices, 1997

7. (Reference) R.C. Jaeger, Introduction to Microelectronic Fabrication; ISBN 0-201-14695-9,‘88

8. (Reference) : Science Engineering Semidonductor Fabrication 2nd Edition  by Stephen A. Campbell .

 

 

            2004 Class list

PHYS-242-01

T

02:15PM

-

04:05PM

REI

501B

R

02:15PM

-

04:05PM

REI

172

1 Albertini, Oliver Ruben ora@georgetown.edu COL U4 PHYS 4.0    
2 Bzdega, Jedrzej L. jlb26@georgetown.edu COL U4 PHYS 4.0    
3 Danks, John Michael jmd37@georgetown.edu COL U4 BIOL 4.0    
4 Hatton, Kyle James kjh6@georgetown.edu COL U4 PHYS 4.0    
5 Lyons, Vernon Alrick val4@georgetown.edu COL U4 PHYS 4.0    
6 Nishida, Maki mn74@georgetown.edu COL U4 PHYS 4.0    
7 Reardon, John Duggan jdr8@georgetown.edu COL U4 PHYS 4.0    
8 Yarger, Casey cy3@georgetown.edu COL U4 PHYS 4.0

 

Table of Contents

 

1.       Semiconductor Electronics

2.       Silicon Technology

3.       Metal-Semiconductor Contacts

4.       pn Junctions

5.       Currents in pn Junctions

6.       Bipolar Transistors I: Basic Operation

7.       Bipolar Transistors II: Limitations and Models

8.       Properties of the Oxide-Silicon System

9.       MOS Field-Effect Transistors I: Physical Effects and Models

10.    MOS Field-Effect Transistors II: High-Field Effects

 

    

 

SCHEDULE 2004

 

WEEK-04

MON

TUE

WED

THUR

FRI

30-Aug

Reading Only 1

NO CLASS

Lab-Guide-04

Lab 1. Cleaning & Oxides

 

6-Sep

Reading Only 2

1. MK ch1.

 

Lab 2. 2-sided litho and bulk machining

 

13-Sep

 

2. MK ch2.

 

Lab 3. p+/n+ diffusion

 

20-Sep

 

3. C ch19

 

Lab 4. Inspection and Field Oxide

 

27-Sep

 

4. MK ch3

 

Lab 5. Gate Oxide

 

4-Oct

 

5. MK ch8

 

Lab 6 Metalization/annealing

 

11-Oct

Columbus Day

6. MK ch9

 

Lab 7  COMMERCIAL FET TEST

 

18-Oct

 

MidTerm Exam

 

Lab 8 Wafer probe - 1

 

25-Oct

 

7. MK ch10

 

Lab 9 Wafer probe - 2

 

1-NOV

 

8. MK ch4

 

Lab 10 Wafer probe - 3

 

8-NOV

 

9. MK ch5

 

Lab 11 MEMS chip -1

 

15-NOV

 

10. MK ch6

 

Lab 12 MEMS chip-2

 

22-NOV

 

11. MK ch7

 

THANKSGIVING

 

29-NOV

 

12. MEMS-1

 

Lab 13 MEMS chip-3

 

6-DEC

 

13. MEMS-2

LAST CLASS

 

NO LAB

 

13-DEC

 

 

 

FINAL EXAM (tbc)

 

 

     Lab Notebook evaluation criteria

 

1.      Quality of entry                                                                                                       30

a. Situating the experiment wrt lecture or reading activities

b.Personal quality & content

c. Completeness of observations

d.Summarizing or analyzing provided data sheets.

e. Summarizing Physical principles of operation

f.  Neatness & legibility

 

2.      Diagrams, figures, photos                                                                                        20

a.       Layout

b.      Micro-system

 

3. Data: Quantity & Quality                                                                                           10

 

4. Calculations                                                                                                              20

a.       Regression

b.      Error analysis

c.       Graphical representation]

 

5.      Supplementary information and or thought                                                               10

a.       e.g. Commercial investigation

b.      packaging or manufacture

c.       competitor comparisons

d.      improvements in system performance

 

6.      Questions ( and answers )                                                                                                   10

 

 

 

TOTAL                                                                                                                        100